Influence of Different Interlayers Metals on Properties of Diffusion Bonding Joint of Tungsten to Copper

Influence of Different Interlayers Metals on Properties of Diffusion Bonding Joint of Tungsten to Copper

Author(s):

Publication title:

Eco-materials processing and design X : selected peer reviewed papers from the 10th International Symposium on Eco-Materials Processing and Design, ISEPD, Xian, China, January 13-15, 2009

Title of ser.:

Materials science forum

Ser. no.:

620-622

Pub. Year:

2009

Page(from):

65

Page(to):

68

Pages:

4

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054142
Series ID:	PA00000012
Conf. info. (Name):	International Symposium on Eco-Materials Processing and Design, ISEPD
Conf. info. (Number):	10th
Conf. info. (Venue):	Xian, China
Conf. info. (Date):	2009.01.13-2009.01.15
Note for article:	10th International Symposium on Eco-Materials Processing and Design, ISEPD, Xian, China, January 13-15, 2009

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