A Feasibility Study of Using X-Ray Computer Tomography for Ball Grid Array (BGA) Inspection
- Author(s):
- Publication title:
- Advanced manufacture : focusing on new and emerging technologies : selected peer reviewed papers from the 2007 International Conference on Advanced Manufacture, Tainan, Taiwan, R.O.C., November 26-November 28, 2007
- Title of ser.:
- Materials science forum
- Ser. no.:
- 594
- Pub. Year:
- 2008
- Page(from):
- 331
- Page(to):
- 338
- Pages:
- 8
- Pub. info.:
- Aedermannsdorf, Switzerland: Trans Tech Publications
- ISSN:
- 02555476
- Language:
- English
- Call no.:
- M23650
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Inspection of ball grid array(BGA)solder joints using x-ray cross-sectional images
SPIE - The International Society for Optical Engineering |
7
Conference Proceedings
Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint
Trans Tech Publications |
2
Conference Proceedings
Study on Optical Measurement for Microelectronics BGA(Ball Grid Array)Package Specifications On-line Inspection
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
IMAPS |
SPIE-The International Society for Optical Engineering |
4
Conference Proceedings
Stress behavior of ball grid array (BGA) studied by dynamic electronic speckle pattern interferometry (DESPI)
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
SPIE-The International Society for Optical Engineering |
IMAPS |
6
Conference Proceedings
Inspection system for microelectronics BGA package using wavelength scanning interferometry
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |