Blank Cover Image

Dislocation Networks Formed by Silicon Wafer Direct Bonding

Author(s):
M. Reiche  
Publication title:
Advances in light emitting materials : special topic volume with invited papers only
Title of ser.:
Materials science forum
Ser. no.:
590
Pub. Year:
2008
Page(from):
57
Page(to):
78
Pages:
22
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Why Does a Plasma Treatment Prior to the Wafer Direct Bonding Increase the Bonding Energy of Silicon Wafer Pairs in the Low-Temperature Range?

Wiegand, M., Reiche, M., Kraeuter, G.

Electrochemical Society
7 Conference Proceedings Direct Wafer Bonding of Preamorphized Silicon Wafers

Laporte, A., Sarrabayrouse, G., Benamara, M., Claverie, A., Rocher, A., Lescouzeres, L., PeyreLavigne, A.

MRS - Materials Research Society
2 Conference Proceedings Plasma Activation for Low-Temperature Wafer Direct Bonding

Reiche, M., Wiegand, M., Dragoi, V.

Electrochemical Society
8 Conference Proceedings Wafer Bonding for Optical Microsystems -

Hiller, E., Stolze, D., Wiegand, M., Dragoi, V., Reiche, M.

Electrochemical Society
3 Conference Proceedings Preparation of Pressure Sensors by Semiconductor Wafer Direct Bonding

Merveille, C., Reiche, M., Brouwer, T.G.M.

Electrochemical Society
9 Conference Proceedings Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding

Bakke, T., Friedrichs, M., Volker, B., Reiche, M., Leonardsson, L., Schenk, H., Lakner, H.K.

SPIE - The International Society of Optical Engineering
4 Conference Proceedings Low Temperature Si-Si and GaAs-Si Direct Wafer Bonding using Spin-On Glass Intermediate Layer

Dragoi, V., Alexe, M., Reiche, M.

Electrochemical Society
10 Conference Proceedings Wafer Bonding for Optical MEMS

Bakke, T., Volker, B., Schenk, H., Radu, I., Reiche, M.

Electrochemical Society
5 Conference Proceedings Effect of O 2 Plasma Pretreatment on the Bonding Behavior of Silicon (100) Wafers

Wiegand, M., Kraeuter, G., Reiche, M.

Electrochemical Society
11 Conference Proceedings Wafer Bonding and Layer Transfer Approach for Strained Silicon-on-Insulator(SSOI) Fabrication

Singh, R., Radu, I., Reiche, M., Gosele, U., Christiansen, S.H., Webb, D.

Electrochemical Society
6 Conference Proceedings Epitaxial Wafers Prepared by Hydrophobic Wafer Bonding

Reiche, M., Hiller, E., Stolze, D.

Electrochemical Society
12 Conference Proceedings Silicon Wafer Bonding Using Deposited and Thermal Oxides: A Comparative Study

Radu, I., Singh, R., Reiche, M., Gosele U., Kuck, B., Grabolla, T., Tillack, B., Christiansen, S.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12