Blank Cover Image

Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM

Author(s):
Publication title:
Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea
Title of ser.:
Materials science forum
Ser. no.:
580-582
Pub. Year:
2008
Page(from):
177
Page(to):
182
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball

J.O. Kim, J.P. Jung, J.H. Lee, J. Suh, H.S. Kang

Trans Tech Publications
7 Conference Proceedings Microstructure and Texture Analysis in Twin-Roll Strip Cast Fe-36wt%Ni Alloy

Park, J.Y., Choi, J.T., Kang, T., Oh, K.H., Szpunar, J.A.

Trans Tech Publications
2 Conference Proceedings Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM, and It's Effects on the Shear Force of the Solder Bumps

Park, S. H., Kim, Y. H.

Trans Tech Publications
8 Technical Paper Atomization Characteristics of Common-Rail Diesel Injector with Multi-Hole.

Park, S.W., Bang, S.H., Lee, K.H., Lee, C.S., Lee, J.H.

Society of Automotive Engineers
3 Conference Proceedings A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Choi, J.K., Kang, H.B., Lee, J.W., Jung, S.B., Yang, C.W.

Trans Tech Publications
9 Conference Proceedings Application of TLP (Transient Liquid Phase) Bonding Method to the High Tm Lead-Free Solder

Lee, J. S., Bang, W. H., Jung, J. P., Oh, K. H.

Trans Tech Publications
4 Conference Proceedings Reaction between Sn-In Solder and Under Bump Metallurgy

Choi, J.H., Jung, B.Y., Jun, S.W., Kim, Y.H., Oh, T.S.

Trans Tech Publications
10 Conference Proceedings High Tensile Strength of Drawn Gold

Kang, S. H., Jung, H. S., Bang, W. H., Cho, J. H., Oh, K. H., Kim, D. S., Cho, J. S., Park, Y. J.

Trans Tech Publications
5 Technical Paper Flux-Free Plasma Soldering of Lead-Free Solders.

Moon, J.K., Kang, K.I., Jung, J.P., Lee, J.S., Zhou, Y.

Society of Manufacturing Engineers
11 Conference Proceedings Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Yoon, J. W., Kim, S. W., Jung, S. B.

Trans Tech Publications
6 Conference Proceedings High Pressure Wear Characteristics of Alloyed Ductile Cast Iron-Effect of Cu, Mn, Si and Mo

Bang, W. H., Kang, C. S., Park, J. H., Oh, K. H.

Trans Tech Publications
12 Conference Proceedings Study of 4H-SiC Junction Barrier Schottky(JBS) Diode Using Various Junction Structures

K.H. Kim, Y.H. Kang, J.H. Lee, E.S. Jung, I.H. Kang

Trans Tech Publications
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12