Blank Cover Image

Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Author(s):
Publication title:
Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea
Title of ser.:
Materials science forum
Ser. no.:
580-582
Pub. Year:
2008
Page(from):
71
Page(to):
74
Pages:
4
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

C.Y. Lim, S.Z. Han, S.H. Lee

Trans Tech Publications

Lee, S.H., Lee, C.H., Lim, C.Y.

Trans Tech Publications

M. Goto, N. Teshima, S.Z. Han, T. Yakushiji, S.S. Kim

Trans Tech Publications

S.H. Kim, S.Z. Han, C.J. Kim, S.Y. Ok, I.Y. Hwang, F.X. Yin

Trans Tech Publications

Chu, J.P., Chen, S.H., Yasuda, H.Y., Umakoshi, Y., Inoue, K.

Trans Tech Publications

Lim, C.Y., Jung, J.H., Han, S.Z.

Trans Tech Publications

Heason, C.P., Prangnell, P.B.

Trans Tech Publications

Lee, S.H., Lee, C.H., Chang, S.Y.

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12