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The Effects of Substrate Temperature on the Residual Stress for EBPVD TBCs

Author(s):
Publication title:
Physical and numerical simulation of materials processing : selected peer reviewed papers from the 5th International Conference on Physical and Numerical Simulation of Materials Processing, October 23-27, 2007, held in Zhengzhou, China
Title of ser.:
Materials science forum
Ser. no.:
575-578
Pub. Year:
2008
Pt.:
2
Page(from):
1276
Page(to):
1280
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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