Blank Cover Image

Microstructures and Toughness in Simulated Coarse Grain Heat-Affected Zones of Copper-Bearing Steel

Author(s):
Publication title:
Physical and numerical simulation of materials processing : selected peer reviewed papers from the 5th International Conference on Physical and Numerical Simulation of Materials Processing, October 23-27, 2007, held in Zhengzhou, China
Title of ser.:
Materials science forum
Ser. no.:
575-578
Pub. Year:
2008
Pt.:
2
Page(from):
910
Page(to):
914
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

W. Shu, X.M. Wang, S.R. Li, X.L. He

Trans Tech Publications

R.O. Laitinen, D.A. Porter, L.P. Karjalainen, P. Leiviskä, J. Kömi

Trans Tech Publications

W. Shu, X.M. Wang, C.J. Shang, X.L. He

Trans Tech Publications

Y.Q. Zhang, H.Q. Zhang, Z.Y. Li

Trans Tech Publications

S. Anttila, L.P. Karjalainen, D.A. Porter

Trans Tech Publications

Zhao, Yi Sheng, Zhang, Xin Ming

Trans Tech Publications

Wang, Q. F., Shang, C. J., Fu, R. D., Wang, Y. N., Chen, W.

Trans Tech Publications

S.X. Zhang, S.K. Guan, X.T. Liu, C.L. Mo

Trans Tech Publications

S.J. Heikkilä, D.A. Porter, L.P. Karjalainen, R.O. Laitinen, S.A. Tihinen

Trans Tech Publications

K.S. Bang, W.Y. Kim, C. Park, Y.H. Ahn, J.B. Lee

Trans Tech Publications

P.J. Modenesi, R.F. Fajardo, D.B. Santos

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12