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Application of top-down CD-SEM metrology in measuring wafers with resist film thickness of 24 µm with various sidewall profiles

Author(s):
Publication title:
Metrology, inspection, and process control for microlithography XIII : 15-18 March, 1999, Santa Clara, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3677
Pub. Year:
1999
Vol.:
2
Page(from):
965
Page(to):
975
Pages:
11
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819431516 [0819431516]
Language:
English
Call no.:
P63600/3677
Type:
Conference Proceedings

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