Application of top-down CD-SEM metrology in measuring wafers with resist film thickness of 24 µm with various sidewall profiles
- Author(s):
- Publication title:
- Metrology, inspection, and process control for microlithography XIII : 15-18 March, 1999, Santa Clara, California
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3677
- Pub. Year:
- 1999
- Vol.:
- 2
- Page(from):
- 965
- Page(to):
- 975
- Pages:
- 11
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819431516 [0819431516]
- Language:
- English
- Call no.:
- P63600/3677
- Type:
- Conference Proceedings
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