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Effect of Organic Amine in Colloidal Silica Slurry on Polishing-rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization

Author(s):
Publication title:
Chemical Mechanical Polishing 9
Title of ser.:
ECS transactions
Ser. no.:
13(4)
Pub. date:
2008
Page(from):
51
Page(to):
57
Pages:
7
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781605601816 [1605601810]
Language:
English
Call no.:
E23400/13-4 [4]
Type:
Conference Proceedings

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