Blank Cover Image

Effect of Organic Amine in Colloidal Silica Slurry on Polishing-rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization

Author(s):
Publication title:
Chemical Mechanical Polishing 9
Title of ser.:
ECS transactions
Ser. no.:
13(4)
Pub. Year:
2008
Page(from):
51
Page(to):
57
Pages:
7
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781605601816 [1605601810]
Language:
English
Call no.:
E23400/13-4 [4]
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Effect of Alkaline Agent with Organic Additive in Colloidal Silica Slurry on Polishing Rate Selectivity of Polysilicon-to-SiO2 in Polysilicon CMP

H. Hwang, H. Kang, J. Park, U. Paik, H. Park

Electrochemical Society
7 Conference Proceedings Effect of pH on Chemical-Mechanical Polishing of Copper and Tantalum

Jindal, Anurag, Li, Ying, Babu, S.V.

Materials Research Society
2 Conference Proceedings Effect of Slurry Characteristics on Nanotopography Impact in Chemical Mechanical Polishing

Katoh, T., Kim, S.-J., Paik, U., Park, J.-G.

Electrochemical Society
8 Conference Proceedings Colloidal Silica based High Selectivity Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Slurry

Bu, Kyoung-Ho, Moudgil, Brij M.

Materials Research Society
3 Conference Proceedings Electrochemical Testing of Tantalum and Copper in Chemical Mechanical Polishing Slurries

Z. Lin, H. Li, R. Schmidt, R. Baker

Electrochemical Society
9 Conference Proceedings Selectivity Studies on Tantalum Barrier Layer for Copper Chemical Mechanical Planarization

Vijayakumar, A., Du, T., Sundaram, K.B., Desai, V.

Electrochemical Society
4 Conference Proceedings CHEMICAL MECHANICAL POLISHING OF COPPER AND TANTALUM BARRIER: STUDIES ON SLURRY CHEMISTRY FOR OPTIMUM SELECTIVITY

VIJAYAKUMAR, ARUN 1, TODI, RAVI 1, DU, TIANBAO 2, SUNDARAM, KALPATHY 1

Electrochemical Society
10 Conference Proceedings Electrochemical Effects of Various Slurries on the Chemical Mechanical Polishing of Copper-Plated Films

Tsai, Tzu-J'Isuan, Yen, Shi-Chern

Electrochemical Society
5 Conference Proceedings Chemical Mechanical Polishing of Copper Using Silica Slurry

Kondo, S., Sakuma, N., Homma, Y., Ohashi, N.

Electrochemical Society
11 Conference Proceedings The Effect of Slurry Composition and Flatness on Sub-Surface Damage and Removal in Chemical Mechanical Polishing of 6H-SiC

G.S. Lee, H.H. Hwang, C.H. Son, J.W. Choi, W.J. Lee

Trans Tech Publications
6 Conference Proceedings Electrochemical Characterization of Copper and Tantalum Chemical Mechanical Planarization

Liu, J., King, M., Darsillo, M., Baum, T.

Electrochemical Society
12 Conference Proceedings The Chemical-Mechanical Polishing of Copper with Model Slurries

Lee, B-C., Duquette, D.J., Gutmann, R.J.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12