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Evaluation of Barrier CMP Slurries and Characterization of ULK Material Properties Shifts Due to CMP

Author(s):
Publication title:
Dielectrics for nanosystems 3: materials science, processing, reliability, and manufacturing
Title of ser.:
ECS transactions
Ser. no.:
13(2)
Pub. Year:
2008
Page(from):
293
Page(to):
306
Pages:
14
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566776271 [1566776279]
Language:
English
Call no.:
E23400/13-2
Type:
Conference Proceedings

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