Waferlevel Vacuum Packaging: Essential for Microscanners in Mobile Applications
- Author(s):
- Publication title:
- Microelectonics Technology and Devices - SBMicro 2008
- Title of ser.:
- ECS transactions
- Ser. no.:
- 14(1)
- Pub. Year:
- 2008
- Page(from):
- 619
- Page(to):
- 628
- Pages:
- 10
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566776462 [1566776465]
- Language:
- English
- Call no.:
- E23400/14-1
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Wafer-level vacuum packaged resonant micro-scanning mirrors for compact laser projection displays
Society of Photo-optical Instrumentation Engineers |
SPIE-The International Society for Optical Engineering |
2
Conference Proceedings
A novel fabrication technology for anti-reflex water-level vacuum packaged microscanning mirrors
Society of Photo-optical Instrumentation Engineers |
8
Conference Proceedings
Electrostatic 1D microscanner with vertical combs for HD resolution display
SPIE - The International Society of Optical Engineering |
3
Conference Proceedings
Fabrication of microrelief surfaces using a one-step lithography process (Invited Paper)
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
4
Conference Proceedings
In-Line Critical Leak Rate Testing of Vacuum-Sealed and Backfilled Resonating MEMS Devices
Electrochemical Society |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
11
Conference Proceedings
Modified low-temperture direct bonding method for vacuum microelectronics application
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |