Blank Cover Image

Analysis of Electromigration in Dual-Damascene Interconnect Structures

Author(s):
Publication title:
Microelectonics Technology and Devices - SBMicro 2008
Title of ser.:
ECS transactions
Ser. no.:
14(1)
Pub. Year:
2008
Page(from):
337
Page(to):
348
Pages:
12
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566776462 [1566776465]
Language:
English
Call no.:
E23400/14-1
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Electromigration Modeling for Interconnect Structures in Microelectronics

H. Ceric, S. Selberherr

Electrochemical Society
7 Conference Proceedings Electromigration In Submicron Dual-Damascene Cu/Low-K Interconnects

Lee, Ki-Don, Lu, Xia, Ogawa, Ennis T., Matsuhashi, Hideki, Blaschke, Volker A., Augur, Rod, Ho, Paul S.

Materials Research Society
2 Conference Proceedings Transient electro-thermal investigations of interconnect structures exposed to mechanical stress

Holzer, S., Hoilauer, C., Ceric, H., Wagner, S., Langer, E., Grasser, T., Selberherr, S.

SPIE - The International Society of Optical Engineering
8 Conference Proceedings Electromigration Characterization Versus Texture Analysis In Damascene Copper Interconnects

Berger, T., Arnaud, L., Gonella, R., Touet, I., Lormand, G.

Materials Research Society
3 Conference Proceedings Electromigration Reliability Of Dual-Damascene Cu/Oxide Interconnets

Ogawa, E.T., Blaschke, V.A., Bierwag, A., Lee, K., Matsuhashi, H., Griffiths, D., Ramamurthi, A., Justison, P.R., …

Materials Research Society
9 Conference Proceedings Length Effects On The Reliability Of Dual-Damascene Cu Interconnects

Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., …

Materials Research Society
4 Conference Proceedings Three-Dimensional Simulation of Thermal Oxidation and the Influence of Stress

C. Hollauer, H. Ceric, S. Selberherr

Electrochemical Society
10 Conference Proceedings Comparative analysis of pseudo-potential and tight-binding band structure calculations with an analytical two-band k-p model: conduction band of silicon

V. A. Sverdlov, H. Kosina, S. Selberherr

Society of Photo-optical Instrumentation Engineers
5 Conference Proceedings Three-dimensional simulation of sacrificial etching

J. Cervenka, H. Ceric, S. Selberherr

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Challenges of damascene etching for copper interconnect

Ho,P.K.K., Zhou,M.-S., Gupta,S., Chockalingam,R., Li,J.-X., Fan,M.-H.

SPIE - The International Society for Optical Engineering
6 Conference Proceedings Via Electromigration Lifetime Improvement Of Aluminum Dual-Damascene Interconnects By Using Soft Low-k Organic SOG Interlayer Dielectrics

Kaneko, H., Usui, T., Ito, S., Hasunuma, M.

Materials Research Society
12 Conference Proceedings Fabrication of Dual-Damascene Structures in Low Dielectric Constant Polymers for Multilevel Interconnects

Tacito, R., Steinbruchel, C.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12