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Electromigration Reliability Assessment of Cu-based Metallization Systems by a Wafer-Level Approach

Author(s):
Publication title:
2007 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT)
Title of ser.:
ECS transactions
Ser. no.:
8(1)
Pub. Year:
2007
Page(from):
157
Page(to):
162
Pages:
6
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781604238921 [1604238925]
Language:
English
Call no.:
E23400/8-1
Type:
Conference Proceedings

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