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Leveling of Microvias by Electroplating for Wafer Level Packaging

Author(s):
Publication title:
Electrochemical Processing in ULSI and MEMS 3
Title of ser.:
ECS transactions
Ser. no.:
6(8)
Pub. Year:
2007
Page(from):
123
Page(to):
133
Pages:
11
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781604238846 [1604238844]
Language:
English
Call no.:
E23400/6-5 [8]
Type:
Conference Proceedings

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