Electrocodeposition of Silver Particles with Tin for Fabrication of Lead-Free Solder Bumps

Electrocodeposition of Silver Particles with Tin for Fabrication of Lead-Free Solder Bumps

Author(s):

Publication title:

Green Electrodeposition

Title of ser.:

ECS transactions

Ser. no.:

1(13)

Pub. Year:

2006

Page(from):

43

Page(to):

51

Pages:

9

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566774475 [1566774470]

Language:

English

Call no.:

E23400/1-12 [13]

Type:

Conference Proceedings

Details

TDL ID:	ZA00053401
Series ID:	PA00000034
Conf. info. (Name):	ECS meeting
Conf. info. (Number):	208th
Conf. info. (Venue):	Los Angeles, California, USA
Conf. info. (Date):	2005.10.16-2005.10.21
Note for article:	208th ECS Meeting, October 16-October 21, 2005, Los Angeles, California

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