Effect of Prebonding Surface Treatments on Si-Si Direct Bonding : Bonding Void Decrease
- Author(s):
- Publication title:
- Semiconductor wafer bonding 9 : science, technology, and applications
- Title of ser.:
- ECS transactions
- Ser. no.:
- 3(6)
- Pub. Year:
- 2006
- Page(from):
- 239
- Page(to):
- 248
- Pages:
- 10
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566775069 [156677506X]
- Language:
- English
- Call no.:
- E23400/3-6
- Type:
- Conference Proceedings
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