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Sequential Activation Process of oxygen RIE and nitrogen Radical for LiTaO3 and Si Wafer Bonding

Author(s):
Publication title:
Semiconductor wafer bonding 9 : science, technology, and applications
Title of ser.:
ECS transactions
Ser. no.:
3(6)
Pub. Year:
2006
Page(from):
91
Page(to):
98
Pages:
8
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566775069 [156677506X]
Language:
English
Call no.:
E23400/3-6
Type:
Conference Proceedings

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