Study of Poly-SiGe Structural Properties for Modularly Integrated MEMS

Study of Poly-SiGe Structural Properties for Modularly Integrated MEMS

Author(s):

Publication title:

SiGe and Ge, materials, processing, and devices

Title of ser.:

ECS transactions

Ser. no.:

3(7)

Pub. Year:

2006

Page(from):

1131

Page(to):

1142

Pages:

12

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775076 [1566775078]

Language:

English

Call no.:

E23400/3-7

Type:

Conference Proceedings

Details

TDL ID:	ZA00047115
Series ID:	PA00000034
Conf. info. (Name):	SiGe and Ge Materials, Processing, and Devices Symposium ; Joint International Electrochemical Society Meeting ; Meeting of the Electrochemical Society ; Congreso de la Sociedad Mexicana de Electroquimica
Conf. info. (Number):	2nd ; 2006 ; 210th ; 21st
Conf. info. (Venue):	Cancun, Mexico
Conf. info. (Date):	2006.10.29-2006.11.03
Note for article:	210th ECS Meeting, October 29-November 3, 2006, Cancun, Mexico

Similar Items:

1 Conference Proceedings Optimization of Poly-SiGe Deposition Processes for Modular MEMS Integration Lin, Blake C. -Y., King, Tsu-Jae, Howe, Roger T. Materials Research Society	7 Conference Proceedings Materials characterization for MEMS:a comparison of uniaxial and bending tests Johnson,G.C., Jones,P.T., Howe,R.T. SPIE - The International Society for Optical Engineering
2 Conference Proceedings Integrated poly-SiGe nanomechanical resonators for wireless sensor nodes (Invited Paper) Quevy, E. P., King, T. -J., Howe, R. T. SPIE - The International Society of Optical Engineering	8 Conference Proceedings Silicon Carbide Thin Films using 1,3-Disilabutane Single Precursor for MEMS Applications - A Review R. Maboudian, C.S. Roper, C. Carraro, R.T. Howe Electrochemical Society
3 Conference Proceedings (16.4) 4:25 - 4:45 PM - In-situ Doped Poly-SiGe LPCVD Process using BCI3 for Post-CMOS Integration of MEMS Devices Low, C. W., Wasilik, M L., Takeuchi, H., King, T.-J., Howe, R. T. (Univ. CA - Berkeley) Electrochemical Society	9 Conference Proceedings Microassembly technologies for MEMS Cohn,M.B., Bohringer,K.F., Noworolski,J.M., Singh,A., Keller,C.G., Goldberg,K.Y., Howe,R.T. SPIE-The International Society for Optical Engineering
4 Conference Proceedings Poly-SiGe MEMS actuators for adaptive optics [6113-28] Lin, B. C.-Y., King, T.-J., Muller, R. S. SPIE - The International Society of Optical Engineering	10 Conference Proceedings Microassembly technologies for MEMS Cohn,M.B., Bohringer,K.F., Noworolski,J.M., Singh,A., Keller,C.G., Goldberg,K.Y., Howe,R.T. SPIE-The International Society for Optical Engineering
5 Conference Proceedings Low-Temperature LPCVD MEMS Technologies Howe, Roger T., King, Tsu-Jae Materials Research Society	11 Conference Proceedings Microassembly technologies for MEMS Cohn,M.B., Bohringer,K.F., Noworoiski,J.M., Singh,A., Keller,C.G., Goldberg,K.Y., Howe,R.T. SPIE-The International Society for Optical Engineering
6 Conference Proceedings Statistical characterization of fracture of brittle MEMS materials Jones,P.T., Johnson,G.C., Howe,R.T. SPIE - The International Society for Optical Engineering	12 Conference Proceedings Microassembly technologies for MEMS Cohn,M.B., Bohringer,K.F., Noworolski,J.M., Singh,A., Keller,C.G., Goldberg,K.Y., Howe,R.T. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12