Laser Transmission Bonding of Silicon-to-Silicon and Silicon-to-Glass for Wafer Level Packaging and Microsystems
- Author(s):
- Publication title:
- Semiconductor Wafer Bonding 10: Science, Technology, and Applications
- Title of ser.:
- ECS transactions
- Ser. no.:
- 16(8)
- Pub. Year:
- 2008
- Page(from):
- 561
- Page(to):
- 568
- Pages:
- 8
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566776547 [1566776546]
- Language:
- English
- Call no.:
- E23400/16-8
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers using the Micro-Chevron Test
Electrochemical Society |
7
Conference Proceedings
THE INTERFACE OF SILICON SAMPLES JOINED AT ROOM TEMPERATURE BY WAFER DIRECT BONDING IN ULTRAHIGH VACUUM
Electrochemical Society |
2
Conference Proceedings
Comparison of the Mechanical Properties of Low Temperature Bonded Test Samples
Electrochemical Society |
Electrochemical Society |
3
Conference Proceedings
Silicon Wafer Bonding for Encapsulating Surface-Micromechanical-Systems using Intermediate Glass Layers
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
11
Conference Proceedings
Lifetime Properties of Wafer-Bonded Components under Static and Cyclic Loading
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |