Blank Cover Image

Electrical Properties of the Bonding Interface in a (110)/(100) Direct-Silicon-Bonded (DSB) Wafer

Author(s):
Publication title:
Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Title of ser.:
ECS transactions
Ser. no.:
16(8)
Pub. date:
2008
Page(from):
433
Page(to):
440
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
19385862
ISBN:
9781566776547 [1566776546]
Language:
English
Call no.:
E23400/16-8
Type:
Conference Proceedings

Similar Items:

L. Yu, J. Lu, M. Wagener, X. Yu, G. Rozgonyi

Electrochemical Society

V. Macary, G. SarrabaYrouse, M. Bafleur, J.M. Reynes, A.P. Lavigne, A. Claverie

Electrochemical Society

M.C. Wagener, M. Seacrist, G. Rozgonyi

Electrochemical Society

J. Lu, Y. Park, G. Rozgonyi

Electrochemical Society

L. Ling, L. Zhong, A. Buczkowski, Z.J. Radminski, T. Abe, F. Shimura

Electrochemical Society

Yu, J., Wang, Y.M., Lu, J.-Q., Gutmann, R.J.

Electrochemical Society

Yongkook Park, Jinggang Lu, G. A. Rozgonyi

Materials Research Society

10 Conference Proceedings Interface Defects of Bonded Silicon Wafers

Reiche,M., Tong,Q.-Y., Gosele,U., Heydenreich,J.

Trans Tech Publications

Han,W., Yu,J., Wang,L., Wei,H., Zhang,X., Wang,Q.

SPIE-The International Society for Optical Engineering

Dimitrakis, P., Hatzandroulis, S., Tsoukalas, D., Stoimenos, J., Papaioannou, G.J.

Electrochemical Society

Bailey, P.T, Jin, G., Armstrong, B.M., Gamble, H.S.

Electrochemical Society

Morral, A. Fontcuberta i, Zahler, J. M., Atwater, Harry A., Frank, M. M., Chabal, Y. J., Ahrenkiel, P., Wanlass, M.

Materials Research Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12