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MOS Capacitor Evaluation of Deep States at the Interfacial Grain Boundary in (110/100) Bonded Silicon

Author(s):
Publication title:
Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Title of ser.:
ECS transactions
Ser. no.:
16(8)
Pub. Year:
2008
Page(from):
393
Page(to):
399
Pages:
7
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
19385862
ISBN:
9781566776547 [1566776546]
Language:
English
Call no.:
E23400/16-8
Type:
Conference Proceedings

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