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Low Temperature Bonding for Optical Microsystems Applications

Author(s):
E. Higurashi  
Publication title:
Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Title of ser.:
ECS transactions
Ser. no.:
16(8)
Pub. Year:
2008
Page(from):
93
Page(to):
103
Pages:
11
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
19385862
ISBN:
9781566776547 [1566776546]
Language:
English
Call no.:
E23400/16-8
Type:
Conference Proceedings

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