Developments Trends in the Field of Wafer Bonding Technologies

Developments Trends in the Field of Wafer Bonding Technologies

Author(s):

Publication title:

Semiconductor Wafer Bonding 10: Science, Technology, and Applications

Title of ser.:

ECS transactions

Ser. no.:

16(8)

Pub. Year:

2008

Page(from):

81

Page(to):

92

Pages:

12

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566776547 [1566776546]

Language:

English

Call no.:

E23400/16-8

Type:

Conference Proceedings

Details

TDL ID:	ZA00047171
Series ID:	PA00000034
Conf. info. (Name):	Pacific Rim Meeting, PRiME ; Meeting of ECS-The Electrochemical Society ; Fall Meeting of The Electrochemical Society of Japan
Conf. info. (Number):	2008 ; 214th ; 2008
Conf. info. (Venue):	Honolulu, Hawaii, USA
Conf. info. (Date):	2008.10.14-2008.10.16
Note for article:	Pacific Rim Meeting, PRiME 2008: joint International Meeting of the 214th Meeting of ECS-The Electrochemical Society, and the 2008 Fall Meeting of The Electrochemical Society of Japan

Similar Items:

1 Conference Proceedings Bonding and Contacting of MEMS-Structures on Wafer Level Wiemer, M., Fromel, J., Jia, C., Gessner, T. Electrochemical Society	7 Conference Proceedings BCB wafer bonding for microfluidics Hwang, T., Popa, D., Sin, J., Stephanou, H.E., Leonard, E.M. SPIE - The International Society of Optical Engineering
2 Conference Proceedings Application of High and Low Wafer Bonding Processes for Bulk Micromachined Components Wiemer, M., Hiller, K., Hahn, R., Kaufmann, C., Gessner, T. Electrochemical Society	8 Conference Proceedings Si-Si PN Junctions Fabricated by Wafer Bonding in UHV Hobart, K.D., Desmond, C.A., Kub, F.J., Twigg, M.E., Jernigan, G.G. Electrochemical Society
3 Conference Proceedings Laser Transmission Bonding of Silicon-to-Silicon and Silicon-to-Glass for Wafer Level Packaging and Microsystems F. Sari, M. Wiemer, M. Bernasch, J. Bagdahn Electrochemical Society	9 Conference Proceedings Mechanistic Studies of Silicon Wafer Bonding and Layer Exfoliation Weldon, M.K., Marsico, V.E., Chabal, Y.J., Agarwal, A., Eaglesham, D.J., Sapjeta, J., Brown, W.L., Jacobson, D.C., … Electrochemical Society
4 Conference Proceedings Silicon Wafer Bonding for Encapsulating Surface-Micromechanical-Systems using Intermediate Glass Layers Knechtel, R., Heller, J., Wiemer, M., Fromel, J. Electrochemical Society	10 Conference Proceedings Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers using the Micro-Chevron Test Bagdahn, J., Ploessl, A., Wiemer, M., Petzold, M. Electrochemical Society
5 Conference Proceedings Strength and long-term reliability testing of wafer-bonded MEMS Petzold, M., Katzer, D., Wiemer, M., Bagdahn, J. SPIE-The International Society for Optical Engineering	11 Conference Proceedings Dislocation Networks Strain Fields Induced by Si Wafer Bonding Eymery, J., Fournel, F., Rousseau, K., Buttard, D., Leroy, F., Rieutord, F., Rouviere, J.L. Materials Research Society
6 Conference Proceedings Numerical analysis of microring resonator obtained by wafer-bonding technology [5956-48] Kusko, M., Alexandropoulos, D., Tee, C.W., Kapsalis, A., Cristea, D., Syvridis, D., Kusko, C. SPIE - The International Society of Optical Engineering	12 Conference Proceedings Overview on Some Recent Advances in Wafer Bonding Technologies Moriceau, H., Fournel, F., Rayssac, O., Cartier, A.M., Morales, C., Pocas, S., Zussy, M., Jalaguier, E., Biasse, B., … Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12