Implementing ALD Layers in MEMS Processing

Implementing ALD Layers in MEMS Processing

Author(s):

Publication title:

Atomic layer deposition applications 3

Title of ser.:

ECS transactions

Ser. no.:

11(7)

Pub. Year:

2007

Page(from):

3

Page(to):

14

Pages:

12

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775731 [1566775736]

Language:

English

Call no.:

E23400/11-7

Type:

Conference Proceedings

Details

TDL ID:	ZA00052897
Series ID:	PA00000034
Conf. info. (Name):	Symposium on Atomic Layer Deposition Applications ; Meeting of the Electrochemical Society
Conf. info. (Number):	3rd ; 212th
Conf. info. (Venue):	Washington, DC, USA
Conf. info. (Date):	2007.10.08-2007.10.09
Note for article:	3rd Symposium on Atomic Layer Deposition Applications, 212th Meeting of the Electrochemical Society, Hilton Washington, Washington, DC, October 8-9, 2007

Similar Items:

1 Conference Proceedings Growth of Dielectric Ta2O5/HfO2 Thin Film Nanolaminate Capacitors by Atomic Layer Epitaxy Kanniainen, T., Skarp, J., Kattelus, H. Electrochemical Society	7 Conference Proceedings Controlling Fine Metal Particle Surface Reactivity with Atomic Layer Deposition (ALD) Jeffrey R. Wank, Luis F. Hakim, Karen J. Buechler, Steven M. George, Alan Weimer American Institute of Chemical Engineers
2 Conference Proceedings Manufacturing Solutions for Developing Processes and Tools for CVD/ALD of Dielectrics for Nanoelectronic Singh, R., Damjanovic, D., Bolla, H. K., Poole, K. F., Narayan, J. Electrochemical Society	8 Conference Proceedings Controlling Fine Metal Particle Surface Reactivity with Atomic Layer Deposition (ALD) Jeffrey R. Wank, Luis F. Hakim, Karen J. Buechler, Steven M. George, Alan Weimer American Institute of Chemical Engineers
3 Conference Proceedings PASSIVE INTEGRATION PROCESS ON STANDARD AND HIGH RESISTIVITY SILICON Kattelus,Hannu P., Ronkainen,H., Riihisaari,T. IMAPS	9 Conference Proceedings Kinetics and Rutherford backscattering study of the photo-induced solid state chemical reaction between silver and amorphous As33S67 layers Wagner,T., Vlcek,M., Frumar,M., Perina,V., Rauhala,E., Saarilahti,J., Ewen,P.J.S. SPIE-The International Society for Optical Engineering
4 Conference Proceedings Deposition and Etching of 4 um Thick Aluminum Layers for Integrated Inductors Franssila, S., Kattelus, H., Pirila, N., Riihisaari, T. Electrochemical Society	10 Conference Proceedings Wet Refinement of Dry Etched Trenches in Silicon Kattelus, H.P. Electrochemical Society
5 Conference Proceedings Extremely High-Density Capacitors with ALD High-k Dielectric Layers Klootwijk, J., Kemmeren, A., Wolters, R., Roozeboom, F., Verhoeven, J., Van Den Heuvel, E. Springer	11 Conference Proceedings STRUCTURE, MECHANICAL PROPERTIES, AND OXIDATION BEHAVIOR OF NANOLAYERED MoSi2/SiC COATINGS Hirvonen, J-P., Lappalainen, R., Kattelus,H., Likonen, J., Suni, I., Kung, H., Jervis, T.R., Nastasi, M. Materials Research Society
6 Conference Proceedings Controlling Fine Metal Particle Surface Reactivity with Atomic Layer Deposition (ALD) Jeffrey R. Wank, Luis F. Hakim, Karen J. Buechler, Steven M. George, Alan Weimer American Institute of Chemical Engineers	12 Conference Proceedings Microstructure and mechanical properties of nitrided molybdenum silicide coatings Hirvonen, J-P., Suni, I., Kattelus, H., Lappalainen, R., Torri, P., Kung, H., Jervis, T. R., Nastasi, M. MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12