A methodology for double patterning compliant split and design
- Author(s):
- V. Wiaux ( IMEC, Belgium )
- S. Verhaegen ( IMEC, Belgium )
- F. Iwamoto ( Panasonic, Japan )
- M. Maenhoudt ( IMEC, Belgium )
- T. Matsuda ( Panasonic, Japan )
- Publication title:
- Lithography Asia 2008
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 7140
- Pub. Year:
- 2008
- Vol.:
- 1
- Page(from):
- 71401X-1
- Page(to):
- 71401X-14
- Pages:
- 14
- Pub. info.:
- Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers
- ISSN:
- 0277786X
- ISBN:
- 9780819473813 [0819473812]
- Language:
- English
- Call no.:
- P63600/7140
- Type:
- Conference Proceedings
Similar Items:
Society of Photo-optical Instrumentation Engineers |
7
Conference Proceedings
Optical extensions integration for a 0.314-μm2 45-nm node 6-transistor SRAM cell
SPIE - The International Society of Optical Engineering |
2
Conference Proceedings
Double patterning design split implementation and validation for the 32nm node
SPIE - The International Society of Optical Engineering |
8
Conference Proceedings
Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications using RELACS shrink and corresponding OPC
SPIE - The International Society of Optical Engineering |
3
Conference Proceedings
Alternative process schemes for double patterning that eliminate the intermediate etch step
Society of Photo-optical Instrumentation Engineers |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society for Optical Engineering |
5
Conference Proceedings
Pitch doubling through dual-patterning lithography challenges in integration and litho budgets
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
6
Conference Proceedings
Application challenges with double patterning technology (DPT) beyond 45 nm [6349-75]
SPIE - The International Society of Optical Engineering |
12
Conference Proceedings
Lithography options for the 32nm half pitch node and their implications on resist and material technology
Society of Photo-optical Instrumentation Engineers |