Wafer plane inspection for advanced reticle defects

Wafer plane inspection for advanced reticle defects

Author(s):

R. Nagpal ( Intel Corp., USA )
F. Ghadiali ( Intel Corp., USA )
J. Kim ( Intel Corp., USA )
T. Huang ( KLA-Tencor Corp., USA )
S. Pang ( KLA-Tencor Corp., USA )

Publication title:

Photomask and next-generation lithography mask technology XV

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

7028

Pub. Year:

2008

Vol.:

1

Page(from):

70281H-1

Page(to):

70281H-8

Pages:

8

Pub. info.:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819472434 [0819472433]

Language:

English

Call no.:

P63600/7028

Type:

Conference Proceedings

Details

TDL ID:	ZA00052659
Series ID:	PA00000029
Conf. info. (Name):	Photomask and Next-Generation Lithography Mask Technology
Conf. info. (Number):	2008 : 15th
Conf. info. (Venue):	Yokohama, Japan
Conf. info. (Date):	2008.04.16-2008.04.18
Note for article:	Photomask and next-generation lithography mask technology XV, 16-18 April 2008, Yokohama, Japan - Inspection Technology, 70281H, 7028-52

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