Blank Cover Image

Thermal stress analysis of a circular holed specimen

Author(s):
  • W. T. Kim ( Kongju National Univ., South Korea )
  • M. Y. Choi ( Korea Research Institute of Standards and Science, South Korea )
  • J. H. Park ( Korea Research Institute of Standards and Science, South Korea )
  • K. S. Kang ( Korea Research Institute of Standards and Science, South Korea )
Publication title:
Thermosense XXX : 18-20 March 2008, Orlando, Florida, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6939
Pub. Year:
2008
Page(from):
69391G-1
Page(to):
69391G-6
Pages:
6
Pub. info.:
Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780819471307 [0819471305]
Language:
English
Call no.:
P63600/6939
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Detection of delamination defect inside timber by sonic IR

M. Y. Choi, J. H. Park, W. T. Kim, K. S. Kang

Society of Photo-optical Instrumentation Engineers
7 Conference Proceedings A scalable SIMD digital signal processor for high-quality multifunctional printer systems

Kang, H. -J., Choi, Y., Kim, K., Park, I. -C., Kim, J. -W., Lee, E. -H., Gahang, G. -S.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Thermal analysis of water-level LED packages with multichips

J.-W. Choi, J.-M. Kang, J.-W. Kim, J.-H. Choi, D.-H. Kim

Society of Photo-optical Instrumentation Engineers
8 Conference Proceedings Thermal Analysis during Epoxy Casting Process for Joint Units of High Voltage Cable

Koo, H. S., Park, S. J., Kim, W. B., Kim, C. M., Ha, Y. K., Kim, Y. S.

Society of Plastics Engineers, Inc. (SPE)
3 Conference Proceedings A study for effect of rounded contact hole pattern by laser mask writng machine onto wafer process margin [6283-15]

Park, -J. S., Yoon, -H. K., Kang, -H. J., Choi, -Y. J., Lee, -S. Y., Kim. K.

SPIE - The International Society of Optical Engineering
9 Conference Proceedings The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film

Choi, H. W., Moon, M. W., Kim, T. Y., Lee, K. R., Oh, K. H.

Trans Tech Publications
4 Conference Proceedings The real-time health monitoring system of a large structure based on nondestructive testing

Choi, M.-Y., Kang, K.-K., Kim, J.-W., Park, H.-Y.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings Critical dimension control for 32 nm random contact hole array with resist reflow process

J.-M. Park, Y.-M. Kang, S.-W. Park, J.-Y. Hong, H.-K. Oh

Society of Photo-optical Instrumentation Engineers
5 Conference Proceedings Interference pattern analysis of optical CDMA system using the SCAE and SCAD

Kang,T.-G., Choi,J.-K., Park,C.-Y., Choi,Y.-W., Kim,Y.-C.

SPIE - The International Society for Optical Engineering
11 Conference Proceedings Pre-flight performance characterization of RazakSAT medium-sized aperture camera (MAC) [5882-06]

Choi, Y.-W., Kim, E. D., Kang, M.-S., Jeong, S.-K., Yang, S., Kim, J., Kim, E.-E., Park, S.-D., Yang, H.-S., Afiq bin …

SPIE - The International Society of Optical Engineering
6 Conference Proceedings A Study on the Solid Phase Reaction and Thermal Stability in the Ni-Sil-x Gex System Using Rapid Thermal Annealing (RTA) Process

Choi, H.-J., Kim, H.-Y., Ko, D.-H., Ku, J.-H., Choi, C.-J., Choi, S., Fujihara, K., Kang, H.K., Yang, M-H., Yang, C.-W.

Electrochemical Society
12 Conference Proceedings Fulfillment of model-based OPC for contact patterns in 60-nm level logic device

Kim, S.-W., Lee, S.-W., Park, C.-M., Choi, S.-H., Lee, Y.-M., Kang, Y., Yeo, G.-S., Lee, J.-H., Cho, H.-K., Han, W.-S.

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12