The effect of through-the-thickness holes on a reference-free damage diagnosis technique

The effect of through-the-thickness holes on a reference-free damage diagnosis technique

Author(s):

C. Lee ( Korea Advanced Institute of Science and Technology, South Korea )
S. Kim ( Carnegie Mellon Univ., USA )
H. Sohn ( Korea Advanced Institute of Science and Technology, South Korea )

Publication title:

Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2008

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6932

Pub. Year:

2008

Vol.:

1

Page(from):

69321U-1

Page(to):

69321U-11

Pages:

11

Pub. info.:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819471185 [0819471186]

Language:

English

Call no.:

P63600/6932

Type:

Conference Proceedings

Details

TDL ID:	ZA00052563
Series ID:	PA00000029
Conf. info. (Name):	Smart Structures : Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems
Conf. info. (Number):	2008
Conf. info. (Venue):	San Diego, California, USA
Conf. info. (Date):	2008.03.10-2008.03.13
Note for article:	Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2008, 10-13 March 2008, San Diego, California, USA. Session 14. Damage Assessment: Wave Methods, 69321U, 6932-69

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