A hybrid optical package with an 8-channel 18GT/s CMOS transceiver for chip-to-chip optical interconnect

A hybrid optical package with an 8-channel 18GT/s CMOS transceiver for chip-to-chip optical interconnect

Author(s):

E. Mohammed ( Intel Corp., USA )
J. Liao ( Intel Corp., USA )
A. Kern ( Intel Corp., USA )
D. Lu ( Intel Corp., USA )
H. Braunisch ( Intel Corp., USA )

Publication title:

Photonics packaging, integration, and interconnects VIII : 22-24 January 2008, San Jose, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6899

Pub. Year:

2008

Page(from):

68990Z-1

Page(to):

68990Z-11

Pages:

11

Pub. info.:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819470744 [0819470740]

Language:

English

Call no.:

P63600/6899

Type:

Conference Proceedings

Details

TDL ID:	ZA00052530
Series ID:	PA00000029
Conf. info. (Name):	Photonics West - Optoelectronic Materials and Devices : Photonics Packaging, Integration, and Interconnects
Conf. info. (Number):	2008 : 8th
Conf. info. (Venue):	San Jose, California, USA
Conf. info. (Date):	2008.01.22-2008.01.24
Note for article:	Photonics packaging, integration, and interconnects VIII, 22-24 January 2008, San Jose, California, USA - Session 8. Parallel Optical Links (68990Z/6899-31)

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