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Reliability of MEMS devices in shock and vibration overload situations

Author(s):
  • S. Kurth ( Fraunhofer Institute for Reliability and Micro Integration,, Germany )
  • A. Shaporin ( Chemnitz Univ. of Technology, Germany )
  • K. Hiller ( Chemnitz Univ. of Technology, Germany )
  • C. Kaufmann ( Chemnitz Univ. of Technology, Germany )
  • T. Gessner ( Fraunhofer Institute for Reliability and Micro Integration, Germany )
Publication title:
Reliability, packaging, testing, and characterization of MEMS/MOEMS VII : 21-22 January 2008, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6884
Pub. Year:
2008
Page(from):
688409-1
Page(to):
688409-12
Pages:
12
Pub. info.:
Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780819470591 [0819470597]
Language:
English
Call no.:
P63600/6884
Type:
Conference Proceedings

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