Reliability of MEMS devices in shock and vibration overload situations
- Author(s):
- S. Kurth ( Fraunhofer Institute for Reliability and Micro Integration,, Germany )
- A. Shaporin ( Chemnitz Univ. of Technology, Germany )
- K. Hiller ( Chemnitz Univ. of Technology, Germany )
- C. Kaufmann ( Chemnitz Univ. of Technology, Germany )
- T. Gessner ( Fraunhofer Institute for Reliability and Micro Integration, Germany )
- Publication title:
- Reliability, packaging, testing, and characterization of MEMS/MOEMS VII : 21-22 January 2008, San Jose, California, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6884
- Pub. Year:
- 2008
- Page(from):
- 688409-1
- Page(to):
- 688409-12
- Pages:
- 12
- Pub. info.:
- Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers
- ISSN:
- 0277786X
- ISBN:
- 9780819470591 [0819470597]
- Language:
- English
- Call no.:
- P63600/6884
- Type:
- Conference Proceedings
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