Composite-copper, low-thermal-resistance heat sinks for laser-diode bars, mini-bars and single-emitter devices

Composite-copper, low-thermal-resistance heat sinks for laser-diode bars, mini-bars and single-emitter devices

Author(s):

R. Miller ( Spectra-Physics Lasers, USA )
D. Liu ( Spectra-Physics Lasers, USA )
M. Horsinka ( Spectra-Physics Lasers, USA )
T. Nguyen ( Spectra-Physics Lasers, USA )
K. Kuppuswamy ( Spectra-Physics Lasers, USA )

Publication title:

High-power diode laser technology and applications VI : 21-23 January 2008, San Jose, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6876

Pub. Year:

2008

Page(from):

687607-1

Page(to):

687607-8

Pages:

8

Pub. info.:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819470515 [0819470511]

Language:

English

Call no.:

P63600/6876

Type:

Conference Proceedings

Details

TDL ID:	ZA00052507
Series ID:	PA00000029
Conf. info. (Name):	SPIE LASE : High-Power Diode Laser Technology and Applications
Conf. info. (Number):	2008 : 6th
Conf. info. (Venue):	San Jose, California, USA
Conf. info. (Date):	2008.01.21-2008.01.23
Note for article:	High-power diode laser technology and applications VI, 21-23 January 2008, San Jose, California, USA - Session 1. Advanced Mounting, Cooling, and Beam Formation (687607/6876-06)

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