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A new golden bump making method for high power LED flip chip

Author(s):
  • H. Liu ( Tianjin Polytechnic Univ., China )
  • P. Niu ( Tianjin Polytechnic Univ., China )
  • H. Hu ( Institute of Semiconductors, China )
  • H. Chen ( Institute of Semiconductors, China )
  • Z. Xia ( Tianjin Polytechnic Univ., China )
Publication title:
Light-emitting diode materials and devices II : 12-14 November 2007, Beijing, China
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6828
Pub. Year:
2008
Page(from):
682810-1
Page(to):
682810-8
Pages:
8
Pub. info.:
Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780819470034 [0819470031]
Language:
English
Call no.:
P63600/6828
Type:
Conference Proceedings

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