Wafer based mask characterization for double patterning lithography

Wafer based mask characterization for double patterning lithography

Author(s):

R. de Kruif ( ASML Netherlands B.V., Netherlands )
K. Bubke ( Advanced Mask Technology Ctr. GmbH & Co. KG, Germany )
G.-J. Janssen ( ASML Netherlands B.V., Netherlands )
E. van der Heijden ( ASML Netherlands B.V., Netherlands )
J. Fochler ( Toppan Photomasks, Inc., Germany )

Publication title:

EMLC 2008 : 24th European Mask and Lithography Conference : 21-24 January 2008, Dresden, Germany

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6792

Pub. Year:

2008

Page(from):

679204-1

Page(to):

679204-12

Pages:

12

Pub. info.:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819469564 [0819469564]

Language:

English

Call no.:

P63600/6792

Type:

Conference Proceedings

Details

TDL ID:	ZA00052423
Series ID:	PA00000029
Conf. info. (Name):	European Mask and Lithography Conference : EMLC
Conf. info. (Number):	2008 : 24th
Conf. info. (Venue):	Dresden, Germany
Conf. info. (Date):	2008.01.21-2008.01.24
Note for article:	24th European Mask and Lithography Conference : EMLC2008, 21-24 January 2008, Dresden, Germany - Double Patterning (6792-07)

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