Blank Cover Image

THE EFFECTS OF PROCESS-INDUCED DEFECTS ON THE CHEMICAL SELECTIVITY OF HIGHLY-DOPED BORON ETCHSTOPS

Author(s):
Publication title:
Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-29
Pub. Year:
1993
Page(from):
423
Page(to):
432
Pages:
10
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770682 [1566770688]
Language:
English
Call no.:
E23400/940556
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings LOW TEMPERATURE WAFER BONDING OF SURFACES USING A REACTIVE SPUTTERED OXIDE

J.A. Folta, C.B. Hunt, S.N. Farrens

Electrochemical Society
7 Conference Proceedings LOW TEMPERATURE SILICON DIRECT BONDING

B.B. Roberds, S.N. Farrens

Electrochemical Society
2 Conference Proceedings ANALYSIS OF BOND CHARACTERISTICS IN SIDIRECT-BONDED MATERIALS

S.N. Farrens, B.E. Roberds, J.K. Smith, C.B. Hunt

Electrochemical Society
8 Conference Proceedings DEFECTS RELATED TO MIXING BEHAVIOR OF HIGHLY SILICON-DOPED GaAs/A1As SUPERLATTICES

Theodore, N. D., Carter, C. B., Mei, P., Schwarz, S.A., Harbison, J. P., Venkatesan, T.

Materials Research Society
3 Conference Proceedings MECHANICAL TESTING OF BONDED SILICON ON INSULATOR WAFERS

Farrens, S. N., Roberds, B., Boettcher, M. C., Ismail, M. S., Bowewr, R. W., Desmond, C. A., Hunt, C. E.

Materials Research Society
9 Conference Proceedings CHARACTERIZATION OF THIN-FILM BESOI USING A CVD Si1x-y-Gex-By ETCH STOP

Desmond, C.A., Hunt, C.E., Wetteroth, T.

Electrochemical Society
4 Conference Proceedings Packaging methods and techniques for MOEMS and MEMS (Invited Paper)

Farrens, S.N.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies

S.N. Farrens, M. Gabriel

Electrochemical Society
5 Conference Proceedings P+ removal techniques for thin-film BESOI

Desmond, C.A., Hunt, C.E., Collins, S.D.

Electrochemical Society
11 Conference Proceedings CCD camera baseline calibration and its effects on imaging processing and laser beam analysis

Roundy,C.B.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Low-Temperature, In Situ, Plasma Activated Wafer Bonding

Roberds, B.E., Farrens, S.N.

Electrochemical Society
12 Conference Proceedings Thermally Induced Dislocation and Slip Defects in Silicon

Cho, C.R., Kim, Y.S., Lee, J.K., Ko, S.W., Choi, D.J., Son, C.B., Stephens, A.E., Rozgonyi, G.A.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12