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BE-SOI WITH ETCH STOP LAYERS GROWN BY RTCVD

Author(s):
D. Feijóo
M.L. Green
D. Brasen
H.S. Luftman
B.B. Weir
J. Blanco
T. Boone
L.C. Feldman
3 more
Publication title:
Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-29
Pub. date:
1993
Vol.:
1993-29
Page(from):
267
Page(to):
279
Pages:
13
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770682 [1566770688]
Language:
English
Call no.:
E23400/940556
Type:
Conference Proceedings

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