AN ADVANCED DIELECTRIC ISOLATION STRUCTURE FOR SOI-CMOS/BICMOS VLSIS

AN ADVANCED DIELECTRIC ISOLATION STRUCTURE FOR SOI-CMOS/BICMOS VLSIS

Author(s):

H. Nishizawa

Publication title:

Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

1993-29

Pub. date:

1993

Vol.:

1993-29

Page(from):

176

Page(to):

188

Pages:

13

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566770682 [1566770688]

Language:

English

Call no.:

E23400/940556

Type:

Conference Proceedings

Details

TDL ID:	ZA00051847
Series ID:	PA00000028
Conf. info. (Name):	Second International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications ; Hawaii Meeting of the Elactrochemical Society
Conf. info. (Number):	2nd ; 1993
Conf. info. (Venue):	HI
Conf. info. (Date):	1993.05.16-1993.05.21

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