Blank Cover Image

BONDED-WAFER SOI SMART POWER CIRCUITS IN AUTOMOTIVE APPLICATIONS

Author(s):
Publication title:
Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-29
Pub. Year:
1993
Page(from):
129
Page(to):
143
Pages:
15
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770682 [1566770688]
Language:
English
Call no.:
E23400/940556
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Photodiodes in Bonded SOI Films

Harendt, C., Beintner, J., Schunbauer, A., Apel, U., Dudek, V., Graf, H.-G., Hoefflinger, B., Seger, U.

Electrochemical Society
7 Conference Proceedings High Volume Manufacturing of SOI Bonded Wafers

Easter, W.G, Goodwin, C.A., Hsieh, C.M., Shanaman, R.H., Wallace, S.W., Worrell, M.J.

Electrochemical Society
2 Conference Proceedings Vertical Polysilicon Interconnects by Aligned Wafer Bonding

Harendt, C., Schuhbauer, A., Apel, U., Dudek, V., Graf, H.-G., Hoefflinger, B., Penteker, E.

Electrochemical Society
8 Conference Proceedings Smart-Cut(R): The Basic Fabrication Process for Unibond(R) SOI Wafers

Auberton-Herve, A. J., Barge, T., Metral, F., Bruel, M., Aspar, B., Meleville, C., Moriceau, H., Poumeyrol, T.

MRS - Materials Research Society
3 Conference Proceedings Unibond SOI wafers achieved by Smart-Cut process

Bruel, M., Aspar, B., Maleville, C., Moriceau, H., Auberton-Herve, A.J., Barge, T.

Electrochemical Society
9 Conference Proceedings Automotive Semiconductor Devices Using Bonded SOI Wafers

S. Fujino, H. Himi

Electrochemical Society
4 Conference Proceedings Unibond SOI Wafers Achieved by Smart-Cut Process

Bruel, M., Aspar, B., Maleville, C., Moriceau, H., Auberton-Herve, A.J., Barge, T.

Electrochemical Society
10 Technical Paper Smart Power Semiconductors - Repetitive Shot Circuit Operation.

Graf, A.

Society of Automotive Engineers
5 Conference Proceedings Device Applications Using Bonded SOI Wafers

Fujino, S., Himi, H., Fukada, T., Yamaguchi, H.(Invited)

Electrochemical Society
11 Conference Proceedings BONDED SOI IN A BIPOLAR IC WITHOUT TRENCH ISOLATION

B.A Beitman, W.G. Easter, C.A Goodwin, R.H. Shanaman

Electrochemical Society
6 Conference Proceedings Device Applications Using Bonded Thick SOI Wafers

Fujino, S., Takahashi, S., Fukada, T., Himi, H., Kawamoto, K.

Electrochemical Society
12 Conference Proceedings Deep trench isolation in bonded wafer SOI ICs using high density ICP etcher

Cowen, C S, Craven, D R, Goodwin, C A, Hsieh, C-M, Jones, G T, Pandhunisoporn, T

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12