Blank Cover Image

Metal-To-Silicon Contact Formation for Highly Reliable ULSI by Low-Energy Ion Bombardment Process

Author(s):
Publication title:
Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-25
Pub. date:
1993
Vol.:
1993-25
Page(from):
256
Page(to):
267
Pages:
12
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770675 [156677067X]
Language:
English
Call no.:
E23400/940140
Type:
Conference Proceedings

Similar Items:

Kawai, Y., Konishi, N., Watanabe, J., Ohmi, T.

Electrochemical Society

Saito, Y., Sekine, K., Hirayama, M., Ohmi, T.

Electrochemical Society

Ohmi, T., Okada, Y., Yabune, T., Ohmi, K.

Electrochemical Society

Stoffel, N. G., Schwartz, S. A., Pudensi, M. A. A., Kash, K., Florez, L. T., Harbison, J. P., Wilkens, B. J.

Materials Research Society

Ohmi, T., Sekine, K., Kaihara, R., Saito, Y., Shirai, Y., Hirayama, M.

MRS - Materials Research Society

Ushiki,T., Hirano,Y., Shimada,H., Ohmi,T.

SPIE-The International Society for Optical Engineering

A. Shima, H. Shimizu, Y. Mori, M. Sagawa, K. Konishi, R. Fujita, T. Ishigaki, N. Tega, K. Kobayashi, S. Sato, Y. …

Trans Tech Publications

Aoyama, T., Konishi, N., Suzuki, T., Miyata, K.

Materials Research Society

Iwai, H., Ohmi, S.-I.

Electrochemical Society

Petravic, M., Williams, J.S., Deenapanray, P.N.K.

Electrochemical Society

N. Mizutani, H. Morinaga, A. Teramoto, T. Ohmi

Electrochemical Society

Yohei Yamada, Nobuhiro Konishi

Materials Research Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12