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Influence of Chemical-Mechanical Polishing Process on Time Dependent Dielectric Breakdown Reliability of Cu/Low-k Integration

Author(s):
Publication title:
Science and technology of chemical mechanical planarization (CMP) : symposium held April 14-16, 2009, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
1157
Pub. Year:
2010
Page(from):
67
Page(to):
78
Pages:
12
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781605111308 [1605111309]
Language:
English
Call no.:
M23500/1157
Type:
Conference Proceedings

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