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Adhesion and Cu Diffusion Barrier Properties of a MnOx Barrier Layer Formed with Thermal MOCVD

Author(s):
Koji Neishi
Vijay Kumar Dixit
S. Aki
Junichi Koike
K. Matsumoto
H. Sato
H. Itoh
S. Hosaka
3 more
Publication title:
Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2009 : symposium held April 14-17, 2009, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
1156
Pub. Year:
2009
Page(from):
99
Page(to):
104
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781605111292 [1605111295]
Language:
English
Call no.:
M23500/1156
Type:
Conference Proceedings

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