Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking
- Author(s):
- Publication title:
- Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 1112
- Pub. Year:
- 2009
- Page(from):
- 121
- Page(to):
- 132
- Pages:
- 12
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781605110844 [1605110841]
- Language:
- English
- Call no.:
- M23500/1112
- Type:
- Conference Proceedings
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