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Current and Future 3D-LSI Technology for the Image Sensor Devices

Author(s):
Publication title:
Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
1112
Pub. date:
2009
Vol.:
1112
Page(from):
25
Page(to):
32
Pages:
8
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781605110844 [1605110841]
Language:
English
Call no.:
M23500/1112
Type:
Conference Proceedings

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