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A Study of Interfacial Layer Effect Synthesized by High Energy Ion Cascade on Adhesion Strength Deterioration Between Copper Thin Film and Polyimide Substrates

Author(s):
  • Y.M. Chung ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
  • W.S. Jung ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
  • C.S. Moon ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
  • J.G. Han ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
Publication title:
48th annual technical conference proceedings, April 23-28, 2005, Denver, Colorado
Title of ser.:
Annual Technical Conference of Society of Vacuum Coaters
Ser. no.:
48
Pub. date:
2005
Vol.:
48
Page(from):
739
Page(to):
744
Pages:
6
Pub. info.:
Albuquerque, NM: Society of Vacuum Coaters
ISSN:
07375921
Language:
English
Call no.:
A63930/48
Type:
Conference Proceedings

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