Comparison of Modular Measurement Methods Based on Consistency Analysis and Sensitivity Analysis

Comparison of Modular Measurement Methods Based on Consistency Analysis and Sensitivity Analysis

Author(s):

Publication title:

ASME 2003 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference (IDETC/CIE2003)

Title of ser.:

ASME Symposia Volumes

Ser. no.:

DETC 2003(3)

Pub. Year:

2003

Vol.:

3

Paper no.:

DETC2003/DTM-48634

Page(from):

393

Page(to):

402

Pages:

10

Pub. info.:

New York, N.Y.: American Society of Mechanical Engineers

ISBN:

9780791837016 [0791837017]

Language:

English

Call no.:

A11633/2003

Type:

Conference Proceedings

Details

TDL ID:	ZA00048580
Series ID:	PA00000270
Conf. info. (Name):	ASME Design Engineering Technical Conferences ; Design for Manufacturing Conference ; International Conference on Design Theory and Methodology ; Reliability, Stress Analysis and Failure Prevention Conference ; Safety Engineering and Risk Analysis
Conf. info. (Number):	2003 ; 8th ; 15th ; 17th ; 2003
Conf. info. (Venue):	Chicago, IL, USA
Conf. info. (Date):	2003.09.02-2003.09.06

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