A Framework for Efficient and More Realistic Haptics Applications

A Framework for Efficient and More Realistic Haptics Applications

Author(s):

Publication title:

23rd Computers and Information in Engineering Conference, Parts A and B; Volume 1

Title of ser.:

ASME Symposia Volumes

Ser. no.:

DETC 2003(1B)

Pub. Year:

2003

Vol.:

1B

Paper no.:

DETC2003/CIE-48291

Page(from):

1097

Page(to):

1104

Pages:

8

Pub. info.:

New York, N.Y.: American Society of Mechanical Engineers

ISBN:

9780791836996 [0791836991]

Language:

English

Call no.:

A11633/2003

Type:

Conference Proceedings

Details

TDL ID:	ZA00048577
Series ID:	PA00000270
Conf. info. (Name):	ASME Design Engineering Technical Conferences ; Computers and Information in Engineering Conference
Conf. info. (Number):	2003 ; 23rd
Conf. info. (Venue):	Chicago, IL, USA
Conf. info. (Date):	2003.09.02-2003.09.06

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