Embedding Device Solutions in Engineered Substrates
- Author(s):
- C. Mazure
- Publication title:
- Silicon-on-insulator technology and devices 13
- Title of ser.:
- ECS transactions
- Ser. no.:
- 6(4)
- Pub. Year:
- 2007
- Page(from):
- 3
- Page(to):
- 14
- Pages:
- 12
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566775533 [1566775531]
- Language:
- English
- Call no.:
- E23400/6-4
- Type:
- Conference Proceedings
Similar Items:
Society of Vacuum Coaters |
7
Conference Proceedings
Fabrication of Directly Bonded Si Substrates with Hybrid Crystal Orientation for Advanced Bulk CMOS Technology
Electrochemical Society |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
Materials Research Society |
10
Conference Proceedings
Actuator Capabilities of Piezoelectric Devices Embedded in Composite Laminate
Trans Tech Publications |
Materials Research Society |
11
Conference Proceedings
*Effects of interface roughness and embedded nanostructures on device properties
MRS-Materials Research Society |
6
Conference Proceedings
Chromium(VI)-free Defect Etching Solutions for Application on Engineered Silicon Substrates
Electrochemical Society |
12
Conference Proceedings
Electron Transport in Engineered Substrates: Strain, Orientation, and Channel/Insulator Material Effects
Electrochemical Society |