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Copper Diffusion and Corrosion Behavior Through the Hillock Defect Found Beneath the Weak SiN Dielectric Barrier in Dual Damascene Process

Author(s):
S. Kim
C. Shim
J. Hong
H. Lee
J. Han
K. Kim
Y. Kim
2 more
Publication title:
Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing
Title of ser.:
ECS transactions
Ser. no.:
2(1)
Pub. Year:
2006
Page(from):
237
Page(to):
242
Pages:
6
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566774383 [1566774381]
Language:
English
Call no.:
E23400/2-1
Type:
Conference Proceedings

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