Electromigration in sub-micron Copper Interconnects in Low-k Dielectrics

Electromigration in sub-micron Copper Interconnects in Low-k Dielectrics

Author(s):

B. Agarwala

Publication title:

Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA

Title of ser.:

ECS transactions

Ser. no.:

1(11)

Pub. Year:

2006

Page(from):

77

Page(to):

92

Pages:

16

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566774994 [1566774993]

Language:

English

Call no.:

E23400/1-11

Type:

Conference Proceedings

Details

TDL ID:	ZA00047105
Series ID:	PA00000034
Conf. info. (Name):	ECS meeting
Conf. info. (Number):	208th
Conf. info. (Venue):	Los Angeles, California, USA
Conf. info. (Date):	2005.10.16-2005.10.21

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