Iridium Barriers for Direct Copper Electrodeposition in Damascene Processing

Iridium Barriers for Direct Copper Electrodeposition in Damascene Processing

Author(s):

D. Josell

Publication title:

Atomic layer deposition : at the 208th ECS Meeting, October 16-21, 2005, Los Angeles, California, USA

Title of ser.:

ECS transactions

Ser. no.:

1(10)

Pub. Year:

2006

Page(from):

57

Page(to):

62

Pages:

6

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566774437 [1566774438]

Language:

English

Call no.:

E23400/1-10

Type:

Conference Proceedings

Details

TDL ID:	ZA00047104
Series ID:	PA00000034
Conf. info. (Name):	ECS Meeting
Conf. info. (Number):	208th
Conf. info. (Venue):	Los Angeles, California, USA
Conf. info. (Date):	2005.10.16-2005.10.21

Similar Items:

1 Conference Proceedings Copper Electrodeposition on Osmium: A Potential Barrier for Damascene Processing D. Josell, C. A. Witt, T. Moffat Electrochemical Society	7 Conference Proceedings Electroplated Damascene Copper: Process Influences on Recrystallization and Texture Barr, D., Brown, W. L., Drese, R., Evans-Lutterodt, K., Golovin, D., Graham, L., Gross, M. E., Lingk, C., Ritzdorf, T., … Materials Research Society
2 Conference Proceedings Superconformal Electrodeposition of Copper Moffat, T.P., Bonevich, J.E., Huber, W.H., Stanishevshky, A, Kelly, D.R., Stafford, G.R., Josell, D. Electrochemical Society	8 Conference Proceedings Atomic Layer Deposition of Thin Films for Microelectronics Ritala, M., Leskela, M. Electrochemical Society
3 Conference Proceedings Control of Overfill Bumps in Damascene Cu Electrodeposition T. Moffat, S. Kim, D. Josell Electrochemical Society	9 Conference Proceedings Superconformal Film Growth: Mechanism and Quantification T. Moffat, D. Wheeler, D. Josell Electrochemical Society
4 Conference Proceedings Atomic layer deposition of metal thin films Leskela, M., Aaltonen, T., Hamalainen, J., Niskanen, A., Ritala, M. Electrochemical Society	10 Conference Proceedings An Investigation of the Effects of Wafer Curvature Changes During Copper Damascene Processing Carpio, R.A., Dorris, S.-T.L., Woodring, J., Owen, D.M., Abisia, D. Electrochemical Society
5 Conference Proceedings Atomic Layer Deposition of Ruthenium from RuCp2 and Oxygen: Film Growth and Reaction Mechanism Studies Aaltonen, T., Rahtu, A., Ritala, M., Leskelae, M. Electrochemical Society	11 Conference Proceedings Scale-up of the BaTiO₃ ALD Process onto 200mm Wafer R. Matero, A. Rahtu, S. Haukka, M. Tuominen, M. Vehkamäki, T. Hatanpää, M. Ritala, M. Leskelä Electrochemical Society
6 Conference Proceedings Electroplated Damascene Copper: Process Influences on Recrystallization and Texture Gross, M. E., Drese, R., Lingk, C., Brown, W. L., Evans-Lutterodt, K., Barr, D., Golovin, D., Ritzdorf, T., Turner, J., … MRS - Materials Research Society	12 Conference Proceedings Atomic Layer Deposited Protective Layers M. Leskela, E. Salmi, M. Ritala Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12