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THE EFFECTS OF pH ADJUSTORS IN POST Cu CMP CLEANING SOLUTIONS ON PARTICLE ADHESION AND REMOVAL

Author(s):
Y.-K. Hong
J.-H. Song
Y.-J. Kang
I.-K. Kim
J.-G. Park
H.-S. Song
K.-S. Kim
J.-J. Myung
H.-J. Lee
S.-Y. Song
5 more
Publication title:
Cleaning Technology in Semiconductor Device Manufacturing IX
Title of ser.:
ECS transactions
Ser. no.:
1(3)
Pub. date:
2006
Page(from):
333
Page(to):
340
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
19385862
ISBN:
9781566774291 [1566774292]
Language:
English
Call no.:
E23400/1-3
Type:
Conference Proceedings

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